2022年材料科学与工程国际会议

会议简介 Brief Introduction

CoMSE 2022将围绕“材料科学与工程”的最新研究领域而展开,为研究人员,工程师和学者,以及行业专业人士提供一个平台并介绍他们的最新的研究成果以及今后开发的活动,为参会人员们交流新的思想和应用经验建立业务或研究关系。本次会议将于2022年3月19-21日在中国上海召开,在会议期间您将有机会聆听到前沿的学术报告,见证该领域的成果与进步。

重要信息 Highlights

会议网址: www.icomse.org
会议时间: 2022年3月19-21日
召开地点: 中国上海
截稿时间: 2022年2月25日

录用通知: 投稿后2周内

出版社：JPCS

收录检索: EI,Scopus

投稿方式

请作者按照官网模板格式进行排版。排版好的论文全文(word+pdf版)发送至CMT在线系统或者会议邮箱。

提交摘要:即只参会做报告,不出版文章;

提交全文:即做参会做报告,并且出版文章;

听众:则不需要提交稿件,注册成功的听众可以参加会议的所有分会;

征稿主题 Call for Paper

CoMSE 2022 calls for articles in all areas of materials science and engineering including, but not limited to:

Nanomaterials and Nanotechnology

Nanofabrication, nanometrology and applications

Nanomaterials and nanomanufacturing

Materials, Properties and Characterization

Ceramics and glasses

Chemistry and fundamental properties of matter

Materials Characterization

Materials forming, Casting and solidification

Materials in structural design and modelling

Strength, durability, and mechanical behavior of materials

Surface, subsurface, and interface phenomena

Functional Materials

Advanced Materials

Functional Materials

Electronic materials

Magnetic materials

Photonic materials

Semiconductor materials

Smart Materials

Energy Materials

Energy materials – synthesis and applications

Green and renewable materials

Polymer Materials, Polymer Electrolytes

Materials Engineering

Computer-aided design, manufacturing, and engineering

Computational materials

Environmentally sustainable manufacturing processes

Machining

Manufacturing process planning and scheduling

Material synthesis, fabrication, manufacture, and processing

Mechanical and Electronic Engineering Control

Meso, micro manufacturing equipment and processes

Laser based manufacturing

Metal alloys

Precision molding processes

Composite Materials

Coatings, corrosion and surface engineering

Composite, nanocomposite, polymer composite materials

BioMaterials

Biomaterials

Biomedical manufacturing

注册费用 Registration

Registration Fee

Category	Early (due by Oct. 16, 2021)	Regular (due by Dec.15, 2021)	Late (after Dec. 15, 2021)	On-Site (March 19-21, 2022)	Online Presentation (Until March 19, 2022)
IAEEEE Member Author	USD 480	USD 500	USD 530	USD 580	USD 350
Nonmember Author	USD 500	USD 530	USD 580	USD 610	USD 380
Student Author	USD 450	USD 480	USD 520	USD 550	USD 320
Presentation Only	USD 400	USD 450	USD 480	USD 530	USD 250
Listener	USD 350	USD 400	USD 450	USD 500	USD 200
Extra Page	USD 70/Page
Extra Paper Upload	USD 370/Paper
Extra Banquet Ticket	USD 50/Ticket
Social Networking Event	TBD

出版信息 Publication

所有注册并发表的文章将会出版到JPCS,并由JPCS提交 Ei Compendex, Scopus, CPCI, Google Scholar, Cambridge Scientific Abstracts (CSA), Inspec, SCImago Journal & Country Rank (SJR), EBSCO, CrossRef, Thomson Reuters (WoS)检索,优秀论文将在国际期刊上发表,热忱地欢迎从事相关技术研究的各专业技术人员踊跃投稿并参加大会。

参会方式 Type of Attendance

1.作者参会: 一篇会议录用文章允许一名作者参会;

2.主讲嘉宾: 申请主题演讲,由会务组审核;

3.口头演讲: 申请口头报告,时间为15分钟;

4.海报参会: 申请海报参会,根据官网模板准备海报,再录制5分钟视频;

5.视频参会: 录制个人视频15分钟即可;

6.听众参会: 不投稿仅参会,可参与问答,也可演讲及展示。